Samsung Electronics Introduces PM1733 SSD and High Density DIMMs Supports AMD EPYCTM 7002 Series Pro

Samsung Electronics announced the release of the Samsung PM1733 PCIe 4th generation Solid State Drive (SSD), as well as high-density RDIMMs (Note 1) and LRDIMM (Note 2) Dynamic Random Access Memory (DRAM) to support the newly released AMD EPYCTM 7002 Series To further strengthen its leading position in the memory market. AMD launched its second-generation AMD EPYCTM processor in San Francisco.

Jinman Han, senior vice president of Samsung's electronic memory product planning, said: "In the process of developing the second-generation AMD EPYC processor, we listened to the needs of our customers and worked closely with Samsung Electronics to integrate our most advanced memory storage products. With a new data center processor, AMD brings a new standard of processors to modern data center customers."

Scott Aylor, vice president and general manager of AMD Data Center Solutions Group, said: "Samsung Electronics is supporting the launch of the second-generation AMD EPYC processor. We are excited and grateful to have such a partner. Breakthrough performance and embedded security performance, and with the full optimization of the leading architecture, customers can transform the operation of the data center as the business grows."

The performance of each slot of the AMD EPYCTM 7002 series processor is expected to double that of the previous generation (Note 3), and the peak FLOPS will be four times higher (Note 4). The new processor delivers consistent, comprehensive I/O, memory and security for the 8-64 core "Zen 2" architecture.

Compared with the current third-generation SSD, Samsung Electronics' new PCIe fourth-generation PM1733 SSD has twice the access speed and is superior in performance to any SSD in the market today. The sequential read speed is 8.0GB per second, and the random read speed is 1500K IOPS. It is available in U.2 (Gen 4 x4) and HHHL (Gen 4 x8). The maximum hard disk capacity is 30.72 TB and 15.36 TB respectively. . The drive is produced with the fifth generation 512 Gb TLC V-NAND technology.

Samsung Electronics will introduce the PM1733 hard drive to the industry this season, including U.2 and HHHL specifications, and will be backward compatible with PCIe's third-generation architecture, providing superior flexibility for existing and future server applications. The drive also has dual-function support for storage and server applications.

In addition to the PM1733 SSD, Samsung Electronics has introduced a full line of RDIMM and LRDIMM DRAM products for the AMD EPYC 7002 series processors. In the application of 8Gb and 16Gb DDR4 component architecture, Samsung Electronics can provide 8GB to 256GB DIMM capacity. With Samsung's high-density DIMMs, users can build up to 4TB of high-capacity storage per CPU.

Note 1: The register dual in-line memory module

Note 2: Low load dual in-line memory module

Note 3: As of July 3, 2019, the AMD EPYC processor is estimated to use the internal computer simulation of the trial production parts and the SPECrate® 2017_int_base test results. The test results vary according to the chipset produced by the mass production. Results of the EPYC 7601 as of June 2019: http://spec.org/cpu2017/results/res2019q2/cpu2017-20190411-11817.pdf. SPEC®, SPECrate®, and SPEC CPU® are registered trademarks of Standard Performance Evaluation Corporation. For more information, please visit the company's official website www.spec.org.

Note 4: The "Zen2"-based processor estimates the floating point number per slot (FLOPS), which is four times higher than the "Zen1" processor.