ON Semiconductor Expands Bluetooth® 5 Radio Series, System-In-Package (SiP) Modules Further Simplify

ON Semiconductor, which drives energy-efficient innovation, extends the Bluetooth 5-certified radio system single-chip (SoC) RSL10 series in an off-the-shelf 6 x 8 x 1.46 mm system-in-package (SiP) module. The RSL10 supports Bluetooth low-power wireless profile profiles, simplifying design into any "connected" application, including sports/fitness or mobile health (Mobile Health; mHealth) wearable devices, smart locks and appliances.

The RSL10 SIP includes an internal antenna, RSL10 radio and all the passive components required in a complete micro solution. The RSL10 SIP is accredited by the Bluetooth SIG, a Bluetooth promotion organization that does not require any additional radio frequency (RF) design considerations, significantly reducing time to market and development costs.

The RSL10 Series delivers 2 Mbps per second and the industry's lowest power consumption via Bluetooth 5, providing advanced wireless capabilities without compromising battery life. The RSL 10 consumes only 62.5 nanowatts (nW) in deep sleep mode and consumes only 7 milliwatts (mW) of peak reception power. The RSL10's energy efficiency has recently been EEMBC ULPMarkTM certified, making it the first component in the history of the benchmark to break through 1,000 ULP Marks, and Core Profile scores are more than double that of former industry leaders.

Michel De Mey, senior director and general manager of ON Semiconductor's Hearing, Consumer Health and Bluetooth Connectivity Solutions, said: "RSL10 has the best power consumption in its class and has been selected for energy harvesting and industrial Internet of Things (IIoT). And many other applications are not surprising. By adding a new system-in-package that significantly reduces design effort, cost and time to market, the RSL10 is infinitely possible."